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| Home > Product > Lapping&Polishing m/c |
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| 1. Adopt water cooling system |
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| Manufactured in special structure to prevent the change of a surface plate by the frictional heat occurs during the process, adopted the system that is preventing the abrasive material congestion at the center of copper and appropriate for high accuracy works. |
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| 2. Adopt Continuously Variable Transmission |
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| For the surface plate drive, the chipping phenomenon of workpiece with smooth motions can be prevented by maintaining the wide variable range of 0~100 by adopting the VECTOR INVERT drive SYSTEM, and applying the functions of SOFT START, SOFT STOP. |
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| 3. Adopt cylinder adjuster |
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| For the flatness management of the surface plate, the system can be controllable by the cylinder in central direction of the surface plate and can make appropriate pressure according to the materials. |
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| Ceramic, hardmetal, ferrite, glass, piezoelectric element, semiconductor wafer, sintered metal, etc. |
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